The NMDC occupies the first floor of the Optics building at the University of Alabama in Huntsville. Primary laboratories include a variety of different clean room conditions designed to meet the specific needs of processes performed within. Photolithography and LPVCD processes reside in a class 1000 cleanroom. Plating and dicing, which are often considered dirty processes, are performed in unmonitored environments. Teaching labs, device testing, wet chemistry and thin film deposition operate in a class 10,000 cleanroom. Independent laboratory testing and polishing are performed in a class 100,000 environment. Particle count, temperature, and humidity are monitored routinely. View the Cleanroom Safety and Training Course Thin Film Deposition Denton Discovery 18 Sputterer (RF, DC, pulsed DC) - Facility Manual Thermal Evaporator - Facility Manual 4 pocket e-beam evaporator 4" RF Sputtering tool Dry Thermal Oxidation Furnace Tystar 4 Tube LPCVD (located in Plasma Processing room) Poly Si Doped Poly Si Low Stress Nitride TEOS Oxide Etching STS Multiplex ASE ICP RIE (Fluorine chemistry) PlasmaTherm 790 RIE Fluorine etcher - Facility Manual Matrix 105 downstream plasma asher - Facility Manual AMMT Single sided KOH etch tool Wet etch/strip of metals Lithography AB-M LS 68 500W contact aligner (Near UV, Mid UV, Deep UV) - Facility Manual OAI J500/VIS contact aligner (Near UV) Ultratech XLS i-line stepper LEO 1550 SEM with e-beam write and EDAX options Bransen 1510 ultrasonic cleaner Sonosys megasonic immersion paddle for thick resist development YES image reversal oven Thermolyne 12000 high temperature furnace 2 programmable vacuum ovens 3 convection ovens 2 SOLITEC - 5110-CD: Coat and Develop Systems - Facility Manual Brewer Science Cee 200 coat and bake system - Facility Manual Metrology and Test Equipment KLA - Tencor P-10 Profilometer Rudolf AutoEL IV ellipsometer - Facility Manual Stress measurement tool Kulicke and Soffa 4123 Wire Bonder Micro Automation 1100 wafer dicing saw - Facility Manual Micromanipulator 6200 probe station Newport Auto-align system PM Fiber Fusion Splicers Agilent Network Impedance Analyzer Plating and Polishing Princeton Applied Research Verastat 3 with 2 Amp option Kocour Hull cell 4 in UAH developed plating tanks Materials: Ni, Permalloy, 45/55 NiFe, NiFeCo, Au, Cu, NiCu Engis Hyprez 15" Lapping tool Computing (Academic Use Only) Dual quad core Xeon chipset w/ 32 GB Ram, 750 MB Nvidia graphics card Ansoft HFSS COMSOL Multiphysics Solidworks Autodesk Matlab Become Partners with the NMDC! Be sure to visit our Partners page to learn what the NMDC can do for you!