ESPEC TSD-100 Thermal Shock
The thermal shock chamber has the capability of taking a system component and subjecting the part to a rapid thermal shock load.
The chamber uses a basket as an elevator that moves a part from one zone to another hot/cold - cold/hot in under 11(s). This can be an important tool when investigating the effects of thermal cycling on system components that encounter various thermal gradients during operation.
In electronics this thermal cycling can prove useful in finding components that have solder stress fractures or problems with the components themselves breaking under the temperature cycling.
To view specifications, click the image to the right or get the pdf below.
Specifications for the Thermal shock chamber
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